Enhanced Thermoelectric Cooling at Cold Junction Interfaces

Citation:

U. Ghoshal, Ghoshal, S., McDowell, C., Shi, L., Cordes, S., and Farinelli, M., “Enhanced Thermoelectric Cooling at Cold Junction Interfaces,” Appl. Phys. Lett., vol. 80, pp. 3006–3008, 2002.

Abstract:

We describe a thermoelectric devicestructure that confines the thermal gradients and electric fields at the boundaries of the cold end, and exploits the reduction of thermal conductivity at the interfaces and the poor electron-phonon coupling at the junctions. The measuredtemperature–current and voltage–current characteristics of a prototype cold point-contactthermoelectric cooler based on a p-type Bi0.5Sb1.5Te3 and n-type Bi2Te2.9Se0.1material system indicate an enhanced thermoelectric figure-of-merit ZT in the range of 1.4–1.7 at room temperature.

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