Facilities & Equipment

Laboratories:

The Nanomaterials & Thermal-Fluids laboratory is located in the Engineering Teaching Center (ETC) building (ETC 7.108, 7.158, 1.104, 1.204B) of the main campus and the Microelectronic and Engineering Research Building (MERB 2.508 & 2.510) of the J. J. Pickle Research Campus. ETC 7.108 is equipped with a Labcono chemical fume hood and a wet sink. ETC 7.158 is equipped with a dropdown hood. ETC 1.104 houses an Omicron ultrahigh vacuum (UHV) scanning tunneling microscope (STM)/atomic force microscope (AFM). ETC 1.204B is an optics lab for inelastic light scattering measurements. MERB 2.510 is equipped with a Hamilton chemical fume hood, two wet sinks,, gas lines connected to hydrogen and methane cylinders located in a separate gas bunker below the lab, and exhaust lines. MERB 2.508 and 2.510 are located above the class-100 clean room facility on the first floor of the building.

Major Equipment:

Major equipment in the Nanomaterials & Thermal-Fluids laboratory includes:

  • An Omicron variable-temperature UHV STM/multimode optical beam deflection AFM
  • A Netzsch laser flash equipment (148 to 1473 K)
  • Netzsch Differential Scanning Calorimeter (123-1273K)
  • Horiba iHR320 Core 3 Raman spectrometer with a SYN-1024x256-BD-PS CCD camera
  • JRS Scientific Instruments TFP-1 Brillouin Light Scattering Interferometer
  • Montana Instruments low temperature magnetic cryostat with optical viewports (3-350 K, 0.3 Tesla)
  • A Janis superconducting magnet cryostat (1.7-325 K, 0-9 Tesla)
  • Two Janis continuous flow helium optical cryostats (4-500 K)
  • Two Janis high-temperature continuous flow helium optical cryostat (4-800 K)
  • A liquid helium Dewar with a home-made variable-temperature insert (4-300K)
  • An Olympus 41 fluorescence microscope
  • One Nikon Eclipse LV100 microscope
  • One Olumpus microscope
  • One MBraun glovebox with moisture and oxygen analyzers
  • A nanomaterials synthesis facility consisting of a number tube furnaces and gas lines for chemical vapor deposition (CVD) growth of carbon nanotubes, graphene, graphite goams, h-BN, and chemical vapor transport (CVT) growth of semiconductor nanowires and nanoplates
  • Two Lindberg box furnaces (1100°C and 1200°C)
  • One Carbolite three-zone tube furnace (1200°C)
  • A box furnace
  • Two Dell Precision Workstations with 670n Dual-Core Intel® Xeon™ Processor
  • Thirteen SRS 830 lock-in amplifiers
  • Ten SR560 low-noise voltage preamplifiers
  • One Keithley 6514 electrometer
  • Two DL1211 low-noise current preamplifier
  • Three SR570 low-noise current preamplifiers
  • Two Agilent 34401A digital multimeters
  • Two Agilent DC power supplies

Central Facilities:

We have access to the following shared laboratory facilities: (i) a class-100 clean room CMOS and MEMS fabrication facility at the Microelectronics Research Center (MRC), which is supported by NSF as a user facility for nano-imprint lithography in the National Nanofabrication Infrastructure Network (NNIN), (ii) a nanofabrication and characterization facility in the Center for Nano and Molecular Science and Technology (CNM), (iii) a materials characterization facility including transmission electron microscopy (TEM) and scanning electron microscopy (SEM) in the Texas Materials Institute.
Major equipment in the shared user facilities includes:

  • Two Digital Instrument Dimension AFMs;
  • A WiTec micro-Raman microscope;
  • An JEOL JBX-6000FS electron beam lithography (EBL) system that is capable of patterning 20 nm features on wafers of various sizes up to 6-inch;
  • A Raith-50 EBL system for small wafer pieces;
  • A FEI dual beam scanning electron microscope/focused ion beam tool equipped with a Zyvex nanomanipulator;
  • A Hitachi S-4500 field-emission scanning electron microscope;
  • A LEO-1530 scanning electron microscope;
  • A high resolution JEOL 2010F transmission electron microscope;
  • A FEI TECNAI G2 F20 X-TWIN TEM that has allowed us to characterize nanotubes and nanowires grown or assembled on our suspended micro-devices with an etched-through hole;
  • Infrared spectrometers;
  • Photolithography equipment including a double-sided aligner;
  • Chemical vapor deposition furnaces for thin film deposition;
  • Evaporators and sputtering machine for metal film deposition;
  • Reactive ion etchers;
  • A deep reactive ion etcher
  • Thermal Technology MODEL SPS 10-3 Spark Plasma Sintering (SPS) equipment