Facilities & Equipment


The Laboratory of Quantum Materials for Sustainable Technologies is located in the Engineering Teaching Center (ETC) building (ETC 7.108, 7.158, 1.104, 1.204B) of the main campus and the Microelectronic and Engineering Research Building (MERB 2.508 & 2.510) of the J. J. Pickle Research Campus. ETC 7.108 is equipped with a Labcono chemical fume hood and a wet sink. ETC 7.158 is equipped with a dropdown hood. ETC 1.104 houses an Omicron ultrahigh vacuum (UHV) scanning tunneling microscope (STM)/atomic force microscope (AFM). ETC 1.204B is an optics lab for inelastic light scattering measurements. MERB 2.510 is equipped with a Hamilton chemical fume hood, two wet sinks,, gas lines connected to hydrogen and methane cylinders located in a separate gas bunker below the lab, and exhaust lines. MERB 2.508 and 2.510 are located above the class-100 clean room facility on the first floor of the building.

Major Equipment:

Major equipment in the Laboratory of Quantum Materials for Sustainable Technologies includes:

  • An Omicron variable-temperature UHV STM/multimode optical beam deflection AFM
  • A Netzsch laser flash equipment (148 to 1473 K)
  • Netzsch Differential Scanning Calorimeter (123-1273K)
  • Horiba iHR320 Core 3 Raman spectrometer with a SYN-1024x256-BD-PS CCD camera
  • JRS Scientific Instruments TFP-1 Brillouin Light Scattering Interferometer
  • Montana Instruments low temperature magnetic cryostat with optical viewports (3-350 K, 0.3 Tesla)
  • A Janis superconducting magnet cryostat (1.7-325 K, 0-9 Tesla)
  • Two Janis continuous flow helium optical cryostats (4-500 K)
  • Two Janis high-temperature continuous flow helium optical cryostat (4-800 K)
  • A liquid helium Dewar with a home-made variable-temperature insert (4-300K)
  • An Olympus 41 fluorescence microscope
  • One Nikon Eclipse LV100 microscope
  • One Olumpus microscope
  • One MBraun glovebox with moisture and oxygen analyzers
  • A nanomaterials synthesis facility consisting of a number tube furnaces and gas lines for chemical vapor deposition (CVD) growth of carbon nanotubes, graphene, graphite goams, h-BN, and chemical vapor transport (CVT) growth of semiconductor nanowires and nanoplates
  • Two Lindberg box furnaces (1100°C and 1200°C)
  • One Carbolite three-zone tube furnace (1200°C)
  • A box furnace
  • Two Dell Precision Workstations with 670n Dual-Core Intel® Xeon™ Processor
  • Thirteen SRS 830 lock-in amplifiers
  • Ten SR560 low-noise voltage preamplifiers
  • One Keithley 6514 electrometer
  • Two DL1211 low-noise current preamplifier
  • Three SR570 low-noise current preamplifiers
  • Two Agilent 34401A digital multimeters
  • Two Agilent DC power supplies

Central Facilities:

We have access to the following shared laboratory facilities: (i) a class-100 clean room CMOS and MEMS fabrication facility at the Microelectronics Research Center (MRC), which is supported by NSF as a user facility for nano-imprint lithography in the National Nanofabrication Infrastructure Network (NNIN), (ii) a nanofabrication and characterization facility in the Center for Nano and Molecular Science and Technology (CNM), (iii) a materials characterization facility including transmission electron microscopy (TEM) and scanning electron microscopy (SEM) in the Texas Materials Institute.
Major equipment in the shared user facilities includes:

  • Two Digital Instrument Dimension AFMs;
  • A WiTec micro-Raman microscope;
  • An JEOL JBX-6000FS electron beam lithography (EBL) system that is capable of patterning 20 nm features on wafers of various sizes up to 6-inch;
  • A Raith-50 EBL system for small wafer pieces;
  • A FEI dual beam scanning electron microscope/focused ion beam tool equipped with a Zyvex nanomanipulator;
  • A Hitachi S-4500 field-emission scanning electron microscope;
  • A LEO-1530 scanning electron microscope;
  • A high resolution JEOL 2010F transmission electron microscope;
  • A FEI TECNAI G2 F20 X-TWIN TEM that has allowed us to characterize nanotubes and nanowires grown or assembled on our suspended micro-devices with an etched-through hole;
  • Infrared spectrometers;
  • Photolithography equipment including a double-sided aligner;
  • Chemical vapor deposition furnaces for thin film deposition;
  • Evaporators and sputtering machine for metal film deposition;
  • Reactive ion etchers;
  • A deep reactive ion etcher
  • Thermal Technology MODEL SPS 10-3 Spark Plasma Sintering (SPS) equipment